Process for forming pattern

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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1566611, 1566591, H01L 21312

Patent

active

054034388

ABSTRACT:
A process for forming a pattern, which includes forming a first resist layer on an article to be fabricated, which article is formed over a substrate, forming a mask layer of Spin On Glass, for etching the first resist layer, on the first resist layer, patterning the mask layer, selectively etching the first resist layer by using the mask layer as a mask, removing the patterned mask layer, by an etching process, selectively etching the article to be fabricated by using the etched first resist layer as a mask, and removing the etched first resist layer to thus form a predetermined pattern.

REFERENCES:
patent: 4244799 (1981-01-01), Fraser et al.
patent: 4589952 (1986-05-01), Behringer et al.
patent: 4747909 (1988-05-01), Kanazawa et al.
patent: 4790903 (1988-12-01), Sugano et al.
patent: 5045150 (1991-09-01), Cleeves et al.
patent: 5169494 (1992-12-01), Hashimoto et al.
S. Wolf, Silicon Processing for the VLSI Era, vol. 1, Lattice Press, Sunset Beach, Calif., 1986, pp. 423-4.

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