Mechanical acceleration multiplier for microcircuit bond testing

Details Mechanical acceleration multiplier for microcircuit bond testing Mechanical acceleration multiplier for microcircuit bond testing

1977-11-09

1979-03-13

Gill, James J.

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

73150A, G01N 1904

Patent

active

041435435

ABSTRACT:
A mechanical acceleration multiplier for testing the bond strength of an adhesive wherein the adhesive to be tested is subjected to a centrifugal force.

REFERENCES:
patent: 3290929 (1966-12-01), Sheldon
"Adhesion Measurement of Thin Films", from "Electrocomponent Science and hnology" vol. 3, No. 1, pp. 21-42, 6-76 pp. 27-29.
"Spin Test Solder Reflow Joints", IBM Technical Disclosure Bulletin vol. 17, No. 3, p. 657, 8-1974.
"Determining the Adhesion Strength . . ." from Industrial Laboratory vol. 40, No. 1, 134-136, 1-1974.

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