1988-10-24
1990-05-08
Davie, James W.
357 72, H01L 2348
Patent
active
049242911
ABSTRACT:
A molded semiconductor package having a flagless leadframe wherein a semiconductor die is disposed in or above a die opening of a leadframe. This allows for thin, symmetrical packages and packages having a minimum number of material interfaces to be manufactured because no leadframe flags and minimal die bond material are employed. The present invention further includes guard rings to protect high stress areas of the semiconductor die from damage and heat spreaders to more effectively spread heat dissipated by the semiconductor die.
REFERENCES:
patent: 3716761 (1973-02-01), Rotast
patent: 3902148 (1975-08-01), Drees et al.
patent: 4466183 (1984-08-01), Burns
patent: 4489465 (1984-12-01), Daberkoe
patent: 4578697 (1986-03-01), Takemae
patent: 4595945 (1986-06-01), Graver
patent: 4612564 (1986-09-01), Moyer
Casto James J.
Hawkins George W.
Hunter William L.
Lesk Israel A.
McShane Michael B.
Davie James W.
Motorola Inc.
Wolin Harry A.
LandOfFree
Flagless semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flagless semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flagless semiconductor package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2353003