Method of producing small conductive members on a substrate

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

15662072, 15662073, 156604, 1566161, 156DIG64, 156DIG80, 156DIG73, 4271261, 437 99, 437170, 437173, 428700, 428620, 428623, C30B 1321, C30B 2102, C30B 2910

Patent

active

047552565

ABSTRACT:
Method of forming alternating narrow strips of conductive metal silicide, specifically cobalt disilicide, and silicon on a substrate as of silicon with a silicon dioxide or silicon nitride surface layer. Cobalt and silicon are deposited on the substrate in the mole ratio of the eutectic composition of cobalt disilicide and silicon. A molten zone is caused to traverse these materials which upon resolidification at the trailing edge of the molten zone segregate into the two eutectic phases forming alternating narrow strata or lamellae of cobalt disilicide and silicon.

REFERENCES:
patent: 4461070 (1984-07-01), Cline
patent: 4477324 (1984-10-01), Cline
patent: 4496634 (1985-01-01), Cline
patent: 4500609 (1985-02-01), Cline
Busch et al, Appl. Phys. Lett. 41(4), 8/82 363-364.
Albers et al, J. Crystal Growth 18(1973) pp. 147-150.
Cline, J. Appl. Physics 52 (1981) pp. 256-261.
Cline, J. Appl. Physics 53(7) pp. 4896-4902.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of producing small conductive members on a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing small conductive members on a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing small conductive members on a substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2330697

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.