Process for manufacturing lead frame for semiconductor package

Details Process for manufacturing lead frame for semiconductor package Process for manufacturing lead frame for semiconductor package

1995-11-14

1997-05-27

Picardat, Kevin

Metal working

Method of mechanical manufacture

Electrical device making

427 96, 438123, H01L 2160

Patent

active

056332068

ABSTRACT:
A process for manufacturing a lead frame having a pad, inner leads, outer leads and dambars, the lead frame being coated with a film on the back surface of the pad, which includes the steps of preparing a lead frame having a pad, inner leads and outer leads; placing a polyamic acid film on the back surface of the pad without using adhesive; and thermally compressing the polyamic acid film by using a heat; generator, to form polyimide film and simultaneously adhere that to the polyimide film the back surface of the pad.

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