Multi cut wafer saw process

Details Multi cut wafer saw process Multi cut wafer saw process

1996-09-16

1998-07-28

Dexter, Clark F.

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

438465, 83861, 83875, 125 12, 225 2, H01L 21304

Patent

active

057862664

ABSTRACT:
A method of cutting a plate-like wafer, particularly a semiconductor wafer, while removing a deposited material from along a scribe line. The deposited material having a width generally greater than the width of the saw blade. The method includes making one scribing cut to one side of the scribe line, making a second scribing cut to the other side of the scribe line, and making a severing cut along the scribe line to dice the wafer.

REFERENCES:
patent: 4355457 (1982-10-01), Barlett et al.
patent: 4851371 (1989-07-01), Fisher et al.
patent: 5000811 (1991-03-01), Campanelli
patent: 5128282 (1992-07-01), Ormond et al.
IBM Technical Disclosure Bulletin, vol. 34, No. 12, May 1, 1992, pp. 311-312, Method of Preventing Damage to Integrated Circuit Chips During Wafer Dicing.

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