Method and apparatus for cleaving semiconductor material

Details Method and apparatus for cleaving semiconductor material Method and apparatus for cleaving semiconductor material

1998-01-09

2000-01-25

Whitehead, Jr., Carl

Semiconductor device manufacturing: process

Semiconductor substrate dicing

438464, 438 68, 438114, 438458, H01L 21301, H01L 2146, H01L 2178, H01L 2100

Patent

active

060178043

ABSTRACT:
The invention disclosed is a method and apparatus for cleaving semiconductor material without physical contact. Tick marks are formed in a major surface of the material where cleaving is desired. A fulcrum member is moved with respect to the material until a tick mark is in alignment with the fulcrum member. A gas jet, also aligned with the fulcrum member, is applied to the surface of the material to form the cleave.

REFERENCES:
patent: 3953919 (1976-05-01), Moore
patent: 5171717 (1992-12-01), Broom et al.
patent: 5314844 (1994-05-01), Imamura
patent: 5393707 (1995-02-01), Canning
patent: 5418190 (1995-05-01), Cholewa et al.
patent: 5904548 (1999-05-01), Orcutt

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