Method for making flexible circuits

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156634, 156655, 156656, 1566591, 1566611, 156668, 156666, 156902, 252 795, 428209, B44C 122, C23F 100, B29C 3700

Patent

active

052270084

ABSTRACT:
A process for making flexible circuits wherein the etching of a polymeric film is accomplished by dissolving portions thereof with concentrated aqueous base using an aqueous processible crosslinked photoresist as a mask, comprising the steps of laminating the resist on a polymeric film, exposing a pattern into the resist, developing the resist with a dilute aqueous solution until desired image is obtained, etching portions of the polymeric film not covered by the crosslinked resist with a concentrated base at a temperature of from about 50.degree. C. to about 120.degree. C., and then stripping the resist off the polymeric film.

REFERENCES:
patent: 3395057 (1968-07-01), Fick
patent: 3448098 (1969-06-01), Gaines et al.
patent: 3469982 (1969-09-01), Celeste
patent: 3526504 (1970-09-01), Celeste
patent: 3867153 (1975-02-01), MacLachlan
patent: 3871930 (1975-03-01), Fish
patent: 4039371 (1977-08-01), Brunner et al.
patent: 4846929 (1989-07-01), Bard et al.
patent: 4857143 (1989-08-01), Glenning et al.
patent: 4911786 (1990-03-01), Kindl et al.
patent: 4986880 (1991-01-01), Dorfman

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for making flexible circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for making flexible circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making flexible circuits will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2309243

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.