Registration and assembly of integrated circuit packages

Details Registration and assembly of integrated circuit packages Registration and assembly of integrated circuit packages

1983-09-09

1986-01-21

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

29834, 361400, H01L 2198

Patent

active

045653143

ABSTRACT:
The so-called blind assembly operation involving precise registration between the blind side of chip carriers or similar macro scale subassemblies and a metallized (patterned) support member requires improvements to reduce packaging costs. The proposal is to form indents aligned in both mating surfaces and place an aligning ball in the lower indent. The upper surface is positioned approximately and manipulated in x and y directions until the alignment ball recesses into both indents.

REFERENCES:
patent: 3184831 (1965-05-01), Siebertz
patent: 3379937 (1968-04-01), Shepherd
patent: 4032058 (1977-06-01), Riseman
patent: 4070120 (1978-01-01), Bald et al.
patent: 4288808 (1981-09-01), Hantusch
patent: 4332341 (1982-06-01), Minetti
patent: 4421266 (1983-12-01), Bock

Affiliated with

Also associated with

Rating

Registration and assembly of integrated circuit packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Registration and assembly of integrated circuit packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Registration and assembly of integrated circuit packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2294993