Multi-chip assembly having a heat sink and method thereof

Details Multi-chip assembly having a heat sink and method thereof Multi-chip assembly having a heat sink and method thereof

1998-12-03

2000-10-10

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361702, 361709, 361710, 361722, 257706, 257708, 174 163, 165 803, 165185, H05K 720

Patent

active

061308218

ABSTRACT:
A multi-chip assembly (100) uses a clip (110) to retain multiple integrated circuits (124-130) to an assembly substrate (140). The use of a thermal medium between the integrated circuits and the heat sinks (120, 122) allows the assembly to be disassembled for rework purposes. The clip contains edge clamps (112), alignment rails (114), and alignment features (116, 316, 416) to properly orient the clip, heat sink, integrated circuits, and assembly substrate.

REFERENCES:
patent: 4169642 (1979-10-01), Mouissie
patent: 4563725 (1986-01-01), Kirby
patent: 4674005 (1987-06-01), Lacz
patent: 4745456 (1988-05-01), Clemens
patent: 5109318 (1992-04-01), Funari et al.
patent: 5323845 (1994-06-01), Lu
patent: 5381305 (1995-01-01), Harmon et al.
patent: 5615735 (1997-04-01), Yoshida et al.

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