Plasma reaction apparatus and plasma reaction

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438164, 438758, 438789, 427572, 427579, H01L 21316

Patent

active

061301183

ABSTRACT:
A process for depositing a film at a high rate and with superior step coverage properties, which comprises installing a pair of electrodes crossing with another pair of electrodes making a right angle with respect to the another pair, and applying a high frequency power differing in phase to the electrodes in order to apply a high frequency power having a Lissajous' waveform in the reaction space during the deposition of a film on a substrate.

REFERENCES:
patent: 4495218 (1985-01-01), Azuma et al.
patent: 4800174 (1989-01-01), Ishihara et al.
patent: 4832981 (1989-05-01), Yamazaki et al.
patent: 5007374 (1991-04-01), Yamazaki et al.
patent: 5149931 (1992-09-01), Magara
patent: 5223039 (1993-06-01), Suzuki
patent: 5223443 (1993-06-01), Chinn et al.
patent: 5330606 (1994-07-01), Kubota et al.
patent: 5332880 (1994-07-01), Kubota et al.
patent: 5345145 (1994-09-01), Harafuji et al.
patent: 5404079 (1995-04-01), Ohkuni et al.
patent: 5424905 (1995-06-01), Nomura et al.
Ibaraki, "Low-Temperature Poly-Si TFT Technology", SID 99 Digest, 15.1 Invited Paper, (1999), pp. 172-175).
Kawamura et al., "Back-Channel Effects on the Threshold Voltage of Low-Temperature Poly-Si TFTs with SiN.sub.x /SiO.sub.2 Dual Under Layer", SID 99 Digest--P2, (1999), pp. 456-459.
Hayasaka, N et al, "High Quality and Low Dielectric Contant SiO.sub.2 CVD Using High Density Plasma", 1993 Dry Process Symposium, p. 163.
Shimokawa, Kimiaki "Fluorine Doped SiO.sub.2 with Low Dielectric Constant for Multilevel Interconnection", p. 211.
Fukasa Takashi "Prepartion of SiOF Films with Low Dielectric Constant by ECR Plasma CVD", In Conf of Solid State, Rev.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Plasma reaction apparatus and plasma reaction does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plasma reaction apparatus and plasma reaction, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma reaction apparatus and plasma reaction will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2255670

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.