Thin type semiconductor device, module structure using the devic

Details Thin type semiconductor device, module structure using the devic Thin type semiconductor device, module structure using the devic

1995-06-07

1998-03-03

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257676, 257686, 257787, 361735, 361773, H01L 2348, H01L 23495

Patent

active

057239037

ABSTRACT:
Ends of inner leads are disposed in the vicinity of a peripheral end of a semiconductor chip and a portion of an insulating film tape is affixed to a main surface of the semiconductor chip by an adhesive while other portions of the insulating film tape are affixed to portions of the inner leads by an adhesive. Electrode pads provided in the main surface of the semiconductor chip are electrically connected to the ends of the corresponding inner leads by bonding wires, and the semiconductor chip, the inner leads, the electrode pads, the insulating film tape and the bonding wares are sealed by a resin molding. The thickness of the insulating film tape is smaller than a height from the main surface of the semiconductor chip to an apex of the bonding wire. Surfaces of the ends of the inner leads connected to the bonding wires are positioned lower than the main surface of the semiconductor chip and the inner leads are positioned between the main surface and an opposite surface of the semiconductor chip.

REFERENCES:
patent: 4649415 (1987-03-01), Hebert
patent: 4698660 (1987-10-01), Kubota et al.
patent: 4943843 (1990-07-01), Okinaga et al.
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5018003 (1991-05-01), Yasunaga et al.
patent: 5055912 (1991-10-01), Murasawa et al.
patent: 5072280 (1991-12-01), Matsukura
patent: 5184208 (1993-02-01), Sakuta et al.
patent: 5245215 (1993-09-01), Sawaya
patent: 5252853 (1993-10-01), Michii
patent: 5394010 (1995-02-01), Tazawa et al.
patent: 5446313 (1995-08-01), Masuda et al.
`DRAM 750P`, Gain 83, Hitashi Ltd, Nov. 1990 pp. 30-31.
Nikkei Microdevices, Feb. 1991 pp. 65-66.

Affiliated with

Also associated with

Rating

Thin type semiconductor device, module structure using the devic does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin type semiconductor device, module structure using the devic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin type semiconductor device, module structure using the devic will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2251254