Optimized process for creating and passivating a metal pillar vi

Details Optimized process for creating and passivating a metal pillar vi Optimized process for creating and passivating a metal pillar vi

1997-05-15

1999-04-20

Martin-Wallace, Valencia

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257760, 257765, H01L 2348

Patent

active

058959750

ABSTRACT:
A metal pillar via structure, formed in a composite dielectric layer, contacting an underlying first level metallization structure, and contacting an overlying second level metallization structure, has been developed. The sides of the metal pillar via structure are first encapsulated with insulator sidewall spacers, and than by a composite dielectric layer, with the top surface of the metal pillar via structure, planar with the top surface of the composite dielectric layer. The metal pillar via structure is comprised of a refractory metal such as tungsten.

REFERENCES:
patent: 4917759 (1990-04-01), Fisher et al.
patent: 4965226 (1990-10-01), Gootzen et al.
patent: 5262354 (1993-11-01), Cote et al.
patent: 5312512 (1994-05-01), Allman et al.
patent: 5354712 (1994-10-01), Ho et al.
patent: 5366911 (1994-11-01), Lur et al.
patent: 5430328 (1995-07-01), Hsue
patent: 5500558 (1996-03-01), Hayashide
patent: 5517062 (1996-05-01), Lur et al.
patent: 5567987 (1996-10-01), Lee
patent: 5635763 (1997-06-01), Inoue et al.
patent: 5639692 (1997-06-01), Teong
patent: 5641994 (1997-06-01), Bollinger et al.
patent: 5646449 (1997-07-01), Nakamura et al.
patent: 5654216 (1997-08-01), Adrian
patent: 5672914 (1997-09-01), Huang et al.
patent: 5723380 (1998-03-01), Wang et al.

Affiliated with

Also associated with

Rating

Optimized process for creating and passivating a metal pillar vi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optimized process for creating and passivating a metal pillar vi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optimized process for creating and passivating a metal pillar vi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2249823