Material or article handling – Apparatus for moving material between zones having different... – For carrying standarized mechanical interface type
Patent
1997-09-30
2000-06-06
Brahan, Thomas J.
Material or article handling
Apparatus for moving material between zones having different...
For carrying standarized mechanical interface type
414937, 414939, B65G 5102
Patent
active
060710551
ABSTRACT:
The present invention provides a wafer process system that incorporates a multiple wafer processing system, such as a tandem wafer processing system, and a front end staging apparatus. The front end staging apparatus includes a first transfer chamber in communication with a pair of loadlocks for introducing wafers into the system. A robot within the first transfer chamber moves individual wafers between the loadlocks, optional single wafer process chambers radially disposed about and in communication with the first transfer chamber, and a pair of intermediate staging chambers. The intermediate staging chambers communicate with both the first transfer chamber and a second transfer chamber of the tandem process system. A robot within the second transfer chamber moves the wafers, in tandem, between the intermediate staging chambers and tandem process chambers disposed about the periphery and communicating with the second transfer chamber.
REFERENCES:
patent: 4785962 (1988-11-01), Toshima
patent: 4819167 (1989-04-01), Cheng et al.
patent: 5120019 (1992-06-01), Davis, Jr.
patent: 5133284 (1992-07-01), Thomas et al.
patent: 5186718 (1993-02-01), Tepman et al.
patent: 5226632 (1993-07-01), Tepman et al.
patent: 5275303 (1994-01-01), Szalai
patent: 5292222 (1994-03-01), Malagrino et al.
patent: 5292393 (1994-03-01), Maydan et al.
patent: 5302209 (1994-04-01), Maeda et al.
patent: 5339128 (1994-08-01), Tateyama et al.
patent: 5363872 (1994-11-01), Lorimar
patent: 5404894 (1995-04-01), Shiraiwa
patent: 5469035 (1995-11-01), Lowrance
patent: 5494494 (1996-02-01), Mizuno et al.
patent: 5505779 (1996-04-01), Mizuno et al.
patent: 5626675 (1997-05-01), Sakamoto et al.
patent: 5700127 (1997-12-01), Harada et al.
patent: 5779799 (1998-07-01), Davis
patent: 5788447 (1998-08-01), Yonemitsu et al.
patent: 5838121 (1998-11-01), Fairbairn et al.
patent: 5844195 (1998-12-01), Fairbairn et al.
patent: 5855681 (1999-01-01), Maydan et al.
patent: 5902088 (1999-05-01), Fairbairn et al.
patent: 5905302 (1999-05-01), Lane et al.
patent: 5909994 (1999-06-01), Blum et al.
patent: 5911834 (1999-06-01), Fairbairn et al.
Z. Shiller and S. Dubowski, "Robot Path Planning with Obstacles, Actuator, Gripper, and Payload Constraints," International Journal of Robotics Research, vol. 8, No. 6, Dec. 1989, pp. 3-18.
Z. Shiller and H.H. Lu, "Computation of Path Constrained Time Optimal Motions With Dynamic Singularities," Transactions of the ASME, Journal of Dynamic Systems, Measurement, and Control, vol. 114, Mar. 1992, pp. 34-40.
Mattson Brochure.
U.S. application No. 08/749,612, Fairbain et al., filed Nov. 18, 1996.
U.S. application No. 08/751,524, Fairbain et al., filed Nov. 18, 1996.
U.S. application No. 08/752,463, Altwood et al., filed Nov. 18, 1996.
Novellus Brochure.
U.S. application No. 08/749,614, Sunder, filed Nov. 18, 1996.
U.S. application No. 08/746,859, Kroeker, filed Nov. 18, 1996.
Applied Materials Inc.
Brahan Thomas J.
LandOfFree
Front end vacuum processing environment does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Front end vacuum processing environment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Front end vacuum processing environment will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2209075