Method of producing conductive pattern layer structure

Details Method of producing conductive pattern layer structure Method of producing conductive pattern layer structure

1993-11-01

1995-01-03

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156902, B44C 122, C23F 100

Patent

active

053783107

ABSTRACT:
A method of forming a conductive pattern layer structure includes providing an insulating member containing polyimide, forming a patterned thin film on the insulating member, and forming a patterned conductive layer on the thin film. The patterned conductive layer contains copper. Further, a barrier layer can be patterned to cover an upper surface and side surfaces of the patterned conductive layer to prevent copper from being diffused into another insulating layer formed around the patterned barrier layer.

REFERENCES:
patent: 4411972 (1983-10-01), Narken et al.
patent: 4720442 (1988-01-01), Shinkai et al.
patent: 4770897 (1988-09-01), Wu
patent: 4810332 (1989-03-01), Pan
patent: 4964945 (1990-10-01), Calhoun
patent: 5227012 (1993-07-01), Brandli et al.

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