Semiconductor device

Details Semiconductor device Semiconductor device

2000-03-09

2000-12-12

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257778, 257780, 257737, 257738, H01L 2302

Patent

active

061603082

ABSTRACT:
The semiconductor device possesses a structure in which on one surface of a wiring substrate a semiconductor element is mounted with a face down and is electrically connected through bumps made of such as solder or the like. In a gap portion between the wiring substrate and the semiconductor element, a resin encapsulation layer (underfill) of epoxy resin or the like is filled to form, thereby alleviating stress due to difference of thermal expansion coefficients of the wiring substrate and the semiconductor element, and mechanically protecting connection portion. An average gap H between the semiconductor element and the wiring substrate, with an average pitch of bumps P and deviation of the gap D, satisfies the equation

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