Method of chemically polishing a doubly rotated quartz plate

Details Method of chemically polishing a doubly rotated quartz plate Method of chemically polishing a doubly rotated quartz plate

1980-05-08

1981-06-23

Massie, Jerome W.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156645, 156663, 252 793, C03C 1500, C03C 1900

Patent

active

042749077

ABSTRACT:
At least one side of a doubly rotated quartz plate whose theta (.theta.) angle is between about 33.degree. and 36.degree. and whose phi (.phi.) angle is between about 10.degree. and 26.degree. is chemically polished by lapping the quartz plate with an abrasive and etching the lapped quartz plate in a fluoride type etchant selected from the group consisting of a 5 percent to 25 percent solution of hydrofluoric acid, a 5 percent to 50 percent solution of ammonium bifluoride, and a mixture of 40 percent ammonium fluoride with 49 percent hydrofluoric acid in the ratio ranging from about 1:3 to 10:1, the etching being carried out until a thickness is removed from the plate that is at least twice the average abrasive particle diameter in the final lapping abrasive.

REFERENCES:
patent: 2479286 (1949-08-01), Wolfskill
patent: 3932777 (1976-01-01), King
Judge, "A Study . . . Fluoride," Journal of the Electro Chemical Society, l. 118, (1975), pp. 1772-1775.
Bond, Zeitschrift fur Kristallographic, Band 99, (1938), pp. 488-498.
Vig et al., "Chemically Polished Quartz," Research and Development Tech. Report Ecom., 4548, (11/77), pp. 131-143.
Iida et al., "Selective Etching . . . System," J. Electro Chemical Soc., vol. 118, No. 5, (5/71), pp. 768-771.
Vig et al., "Etching . . . Plates," 33rd Annual Symposium on Frequency Control, (5/79-6/79).
"System of Rotation . . . Crystalline Bars and Plates," IEEE Standard, 176--1978, (pp. 25-27).

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