Pin grid array solution for microwave multi-chip modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

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257704, 257728, 361742, 361753, 361799, H01L 2304, H01L 2312

Patent

active

056684088

ABSTRACT:
A module technology allows a PGA like package architecture to be used in microwave instruments and other high frequency systems where high isolation, low reflection, and low cost multi-chip modules are needed.

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patent: 5574313 (1996-11-01), McKleroy
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Times Product and Literature Review, May 1993, p. 15.

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