Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1998-07-30

2000-09-05

Ryan, Patrick

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 45, B23K 106, B23K 3700

Patent

active

061129690

ABSTRACT:
A wire bonding method for joining a metal wire with a bonding pad disposed on a semiconductor element by using a load and supersonic wave vibration, comprising: during interval of time from contact of the metal wire with the bonding pad to application of the supersonic wave vibration, continuously applying a first bonding load and a second bonding load which is lower than the first bonding load; and after application of the supersonic wave vibration, continuously applying a third bonding load of a size of about 50% of the load of the second bonding load and a fourth bonding load which is lower than the first bonding load and higher than the third bonding load. The reliability of the fine wire bonding joint is improved remarkably, whereby a high quality semiconductor device cna be produced at a low cost.

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