4. Metal fusion bonding
  5. Process
  6. Using high frequency vibratory energy

Shinji Toyosaki

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Wire bonding apparatus

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Patent

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Wire bonding method, wire bonding apparatus and semiconductor de

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent

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Wire bonding method, wire bonding apparatus and semiconductor de

Metal fusion bonding – Process – Using high frequency vibratory energy
Patent

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Profile ID: LFUS-PAI-P-800141

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