Method for using ultrasound for assisting forming conductive lay

Details Method for using ultrasound for assisting forming conductive lay Method for using ultrasound for assisting forming conductive lay

1999-08-04

2000-12-12

Smith, Matthew

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438653, 438800, H01L 21463

Patent

active

061598534

ABSTRACT:
The present invention provides three embodiments to deposit layers over a substrate using ultrasound energy to vibrate the substrate during (1) PVD or CVD deposition, (2) anneal or (3) plating deposition. The first embodiment deposits a first layer over a substrate using ultrasonic energy to vibrate the substrate. The ultrasound allows the layer to deposit more conformal over opening sidewalls and decreases overhangs and voids. The second embodiment involves using ultrasonic vibrations during annealing or RTA. The ultrasound smooches out barrier/seed/conductive layers in contact holes. The third embodiment is a method of plating a metal layer such as Cu over a substrate while vibrating the substrate with ultrasonic waves. The substrate is vibrated with ultrasound waves in vertical or horizontal direction. The ultrasonic vibration allow the metal to plate in small contact holes with improved step coverage.

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