Method for reducing resistance of contact window

Details Method for reducing resistance of contact window Method for reducing resistance of contact window

1998-08-07

2000-12-12

Elms, Richard

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

H01L 2144

Patent

active

06159850&

ABSTRACT:
A method of reducing resistance of a contact. A semiconductor substrate having at least a conductive lines formed thereon is provided. A self-aligned contact window is formed to expose a part of the substrate. A recess with a ragged surface is formed on the exposed part of substrate within the contact window.

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patent: 5203957 (1993-04-01), Yoo et al.
patent: 5605637 (1997-02-01), Shan et al.
patent: 5670426 (1997-09-01), Kuo et al.
S. A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press, New York, 1996.

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