Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1980-04-04
1982-06-29
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29580, 29591, 156653, 156657, 156643, 357 54, 357 65, 427 88, H01L 21306, C23F 102, B05D 512
Patent
active
043371159
ABSTRACT:
There is provided a method of forming an electrode on the surface of a semiconductor substrate which comprises the steps of
REFERENCES:
patent: 3784424 (1974-01-01), Chang
patent: 3842490 (1974-10-01), Seales
patent: 3951708 (1976-04-01), Dean
patent: 4078963 (1978-03-01), Symersky
Ikeda Masashi
Ito Shintaro
Powell William A.
Tokyo Shibaura Electric Co. Ltd.
LandOfFree
Method of forming electrodes on the surface of a semiconductor s does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming electrodes on the surface of a semiconductor s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming electrodes on the surface of a semiconductor s will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2163921