Bonding pedestals for semiconductor devices

Details Bonding pedestals for semiconductor devices Bonding pedestals for semiconductor devices

1976-09-13

1978-05-02

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29591, 156656, 204192EC, 357 68, C23F 102

Patent

active

040873145

ABSTRACT:
A metallization system and process for forming bonding pedestals suitable for subsequent gang-bonding of multileaded semiconductor devices. The metallurgical components are selected for corrosion resistance and permit the use of selective etchants for yield enhancement.

REFERENCES:
patent: 3653999 (1972-04-01), Fuller
patent: 3761309 (1973-09-01), Schmitter et al.
patent: 3833842 (1974-09-01), Cunningham et al.
patent: 3856648 (1974-12-01), Fuller et al.
patent: 3900944 (1975-08-01), Fuller et al.
patent: 3983023 (1976-09-01), Baker et al.

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