Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-02-12
1993-02-16
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566591, 1566611, 156668, 430296, 430313, 430325, 430394, G03C 500
Patent
active
051867885
ABSTRACT:
Disclosed is a fine pattern forming method which is capable of forming a high positive-to-negative reversal pattern high in dry-etch resistance, at high density, by irradiating an entire surface of a resist with ion shower at low doses before or after electron beam or focus ion beam exposure, and then developing it.
REFERENCES:
patent: 4293374 (1981-10-01), Chaudhari et al.
patent: 4377734 (1983-03-01), Mashiko et al.
patent: 4394211 (1983-07-01), Uchiyama et al.
patent: 4403151 (1983-09-01), Mochiji et al.
patent: 4405710 (1983-09-01), Balasubramanyam et al.
patent: 4514251 (1985-04-01), van Ommen et al.
patent: 4530734 (1985-07-01), Klima
patent: 4552831 (1985-11-01), Liu
patent: 4601778 (1986-07-01), Robb
patent: 4604345 (1986-08-01), Amemiya
patent: 4652334 (1987-03-01), Jain et al.
patent: 4657845 (1987-04-01), Frechet et al.
patent: 4702995 (1987-10-01), Okada
patent: 4716097 (1987-12-01), Weed
patent: 4772539 (1988-09-01), Gillespie
patent: 4775609 (1988-10-01), McFarland
patent: 4803181 (1989-02-01), Buchmann et al.
patent: 4808511 (1989-02-01), Holmes
patent: 4814243 (1989-03-01), Ziger
patent: 4931380 (1990-06-01), Owens et al.
Hashimoto Kazuhiko
Nomura Noboru
Yamashita Kazuhiro
Dang Thi
Matsushita Electric - Industrial Co., Ltd.
LandOfFree
Fine pattern forming method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fine pattern forming method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fine pattern forming method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2146029