Method of heating and cooling large area substrates and apparatu

Details Method of heating and cooling large area substrates and apparatu Method of heating and cooling large area substrates and apparatu

1993-01-28

1997-03-04

Chambers, A. Michael

Heat exchange

Structural installation

Heating and cooling

165 61, 165 805, 118725, F25B 2900, C23C 1458

Patent

active

056070098

ABSTRACT:
Glass substrates suitable for thin film processing can be batch heated to processing temperatures and batch cooled after processing by radiant heating and cooling in a vacuum chamber. The heating and/or cooling chamber is fitted with a cassette including heat conductive shelves that can be heated or cooled, interleaved by the glass substrates mounted on supports so that a gap exists between the shelves and the substrates. As the shelves provide heating or cooling, the glass substrates are radiantly heated or cooled by the shelves, thereby providing uniform heating or cooling of the glass substrates so as to avoid damage or warpage of the substrates.
A vacuum system for processing the substrates includes batch-type heating and cooling of the substrates using the chambers of the invention in combination with one-at-a-time film processing chambers that can deposit one or more thin films on the substrates.

REFERENCES:
patent: 4603243 (1986-07-01), Septfons et al.
patent: 4609037 (1986-09-01), Wheeler et al.
patent: 4951601 (1990-08-01), Maydan et al.
patent: 4979464 (1990-12-01), Kunze-Concewitz et al.
patent: 5097890 (1992-03-01), Nakao
patent: 5135047 (1992-08-01), Dobran
Joint Development Agreement Between Applied Materials, Inc. (Applicant's Assignee) and two unrelated companies (Companies A & B), dated May 29, 1991 (Exhibit A hereto).

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