Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Patent
1997-04-25
1999-11-02
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
257787, H01L 2322
Patent
active
059776226
ABSTRACT:
An electronic semiconductor device package, the package comprising: a substrate having traces; a die attached to the substrate; first level interconnects of the die to the traces of the substrate; and a stiffener attached to the substrate, wherein the stiffener comprises at least one slot. A system for attaching a heat sink to an electronic semiconductor device package, the system comprising: a stiffener of the electronic package which is attachable to the electronic package; a clip which secures the heat sink to the stiffener; and at least one slot in the stiffener which receives the clip. A method of detachably attaching a heat sink to an electronic semiconductor device package, the method comprising: attaching a stiffener to the package, wherein the stiffener comprises at least one slot; positioning a heat sink adjacent the stiffener; and engaging a clip with the slot and the heat sink, wherein the heat sink is secured to the stiffener by the clip.
REFERENCES:
patent: 3305004 (1967-02-01), Barlowe
patent: 3377524 (1968-04-01), Bock
patent: 4235285 (1980-11-01), Johnson
patent: 4323914 (1982-04-01), Berndlmaier
patent: 4481525 (1984-11-01), Calabro
patent: 4607685 (1986-08-01), Mitchell
patent: 4716494 (1987-12-01), Bright
patent: 4764847 (1988-08-01), Eisenblatter
patent: 5003429 (1991-03-01), Baker
patent: 5057903 (1991-10-01), Ollg
patent: 5089936 (1992-02-01), Kojima
patent: 5172301 (1992-12-01), Schneider
patent: 5175612 (1992-12-01), Long
patent: 5182632 (1993-01-01), Bechtel
patent: 5193053 (1993-03-01), Sonobe
patent: 5208731 (1993-05-01), Blomquist
patent: 5227663 (1993-07-01), Patil
patent: 5230759 (1993-07-01), Hiraiwa
patent: 5280409 (1994-01-01), Seina
patent: 5304735 (1994-04-01), Earl
patent: 5311060 (1994-05-01), Rostoker
patent: 5329426 (1994-07-01), Villani
patent: 5384940 (1995-01-01), Soule
patent: 5386144 (1995-01-01), Variot
patent: 5386342 (1995-01-01), Rostoker
patent: 5397919 (1995-03-01), Taty
patent: 5455462 (1995-10-01), Marrs
patent: 5521439 (1996-05-01), Casati et al.
patent: 5525835 (1996-06-01), Nishisuchi
patent: 5548482 (1996-08-01), Hatauchi
patent: 5552634 (1996-09-01), Schneider
patent: 5552635 (1996-09-01), Kim
patent: 5570271 (1996-10-01), Lavochkin
patent: 5596485 (1997-01-01), Glenn
patent: 5610442 (1997-03-01), Schneider
patent: 5615086 (1997-03-01), Collins
patent: 5619399 (1997-04-01), Mok
patent: 5621615 (1997-04-01), Dawson
patent: 5625222 (1997-04-01), Yoneda
patent: 5642265 (1997-06-01), Bond
patent: 5691041 (1997-11-01), Frankery
patent: 5786631 (1998-07-01), Fishley
patent: 5789813 (1998-08-01), Kirkland
patent: 5808868 (1998-09-01), Drekmeier
patent: 5831829 (1998-11-01), Lin
IBM Technical Disclosure Bulletin, vol. 28 No. 12 May 1986 pp. 5172-5173.
Jr. Carl Whitehead
LSI Logic Corporation
Potter Roy
LandOfFree
Stiffener with slots for clip-on heat sink attachment does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stiffener with slots for clip-on heat sink attachment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stiffener with slots for clip-on heat sink attachment will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2139189