Method of forming redundant signal traces and corresponding elec

Details Method of forming redundant signal traces and corresponding elec Method of forming redundant signal traces and corresponding elec

1997-04-22

1999-11-02

Niebling, John F.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438129, 438598, 438599, H01L 2144

Patent

active

059769742

ABSTRACT:
In a method for forming redundant signal traces and corresponding electronic components, a photoresist pattern which defines a semi-additive signal image is coated on at least one first conductive layer of a composite base substrate. A barrier layer of etch-resistant metal is deposited on the first conductive layer. The photoresist is removed, thereby forming a first barrier signal trace having a first line width. Optionally, one or more vias may be formed in the substrate. A surface conductive layer is deposited on the first conductive layer, the barrier layer, and on a surface of the optional vias. A photoresist pattern is coated on the surface conductive layer which defines a subtractive signal image. Predetermined portions of the surface conductive layer and the first conductive layer are removed. The photoresist is removed forming a second signal trace in overlying relationship with the first barrier signal trace and having a second line width greater than the first line width.

REFERENCES:
patent: 4964212 (1990-10-01), Deroux-Dauphin et al.
patent: 4978639 (1990-12-01), Hua et al.
patent: 5106461 (1992-04-01), Volfson et al.
Tummala, R. et al. editors, Microelectronics Packaging Handbook, Semiconductor Packaging, Part II, Second Edition, pp. II-63, II-64, and II-117 (1997).

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