Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-05-04
1990-05-22
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29827, 156634, 156644, 156645, 156656, 1566591, 156902, 357 70, 361421, 437206, 437220, B44C 122, C23F 102, C03C 1500, C03C 2506
Patent
active
049274910
ABSTRACT:
A large number of IC device holes are formed in a carrier tape, and a metal foil is formed on one surface of the tape. The metal foil is etched to form finger leads each having an end projecting into a corresponding IC device hole. Connection leads for connecting finger leads connected to different IC devices are formed on the other surface of the carrier tape. An IC device is located in each IC device hole and bonded to the finger leads. The carrier tape is cut so as to form an IC unit having a plurality of IC devices. Upon this cutting, a conductive lead for plating for connecting the finger leads with each other is cut. The IC unit simplifies wiring on the substrate and increases positioning efficiency with respect to the connection terminals.
REFERENCES:
patent: 3480836 (1969-11-01), Aronstein
patent: 3823467 (1974-07-01), Shamash et al.
patent: 4141075 (1979-02-01), Taylor
Casio Computer Co. Ltd.
Powell William A.
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