Method and apparatus for mechanically cleaning the edges of wafe

Cleaning and liquid contact with solids – Processes – Using solid work treating agents

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Details

134902, 15 77, 15 883, 15 971, B08B 700

Patent

active

059762675

ABSTRACT:
A method and apparatus for cleaning the edges of substrates. The present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based on friction at a point of contact between the wafer and a wafer edge brush. In one embodiment, the cleaning mechanism includes a side brush that cleans the top-side or bottom-side of a wafer. The side brush is rotated by a motor that is attached to a first end of the side brush. An edge brush is attached to a second end of the side brush and is rotated along with the side brush to clean the edge of the wafer.

REFERENCES:
patent: 5144177 (1992-09-01), Rupprecht
patent: 5311634 (1994-05-01), Andros
patent: 5351360 (1994-10-01), Suzuki et al.
patent: 5725414 (1998-03-01), Moinpour et al.
patent: 5852560 (1998-12-01), Takeyama et al.
patent: 5861066 (1999-01-01), Moinpour et al.
patent: 5868857 (1999-02-01), Moinpour et al.

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