Method of thermally dimensionally stabilizing a printed circuit

Details Method of thermally dimensionally stabilizing a printed circuit Method of thermally dimensionally stabilizing a printed circuit

1977-08-05

1978-09-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156659, 156661, 156902, 427 97, 428417, 428418, 428901, C23F 102

Patent

active

041151852

ABSTRACT:
A method of thermally dimensionally stabilizing a printed circuit board prior to drilling and chemically processing wherein the printed circuit board has an epoxy fiberglass base and a layer of conductive material bonded to at least one side of the insulating base by transporting the printed circuit board thru a thermal shocking intense heat having a temperature of about 425.degree. F to about 450.degree. F (about 218.degree. C to about 232.degree. C) and a boiling point temperature in excess of 450.degree. F (232.degree.) for a period of time at least equal to that required to stress relieve the epoxy fiberglass base and promote dimensional movement between the epoxy, fiberglass, and metal conducting layer which the printed circuit board would otherwise experience during the subsequent process steps including the shear displacement between the insulating base and conductive metal layer which would otherwise occur after the selective removal of the conductive metal layer to form conductive metal parts by less than the time required for the conductive metal layer to delaminate from the insulating base is shown.

REFERENCES:
patent: 3672986 (1972-06-01), Schneble et al.
patent: 3808028 (1974-04-01), Lando

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