Process ESD protection devices for use with antifuses

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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Details

257 50, 257530, H01L 2701, H01L 2900

Patent

active

054988950

ABSTRACT:
A process electrostatic discharge ("ESD") protection device is incorporated on a chip with the antifuses that it is designed to protect and is formed as close in time as possible to the deposition of the antifuse material layer (the layer being protected) so that ESD protection is available at all practical stages of processing. According to a first aspect of the invention, an ESD protection device is formed by exposing edges of an antifuse bottom electrode during the antifuse cell open mask/etch step, It is biased on during processing. A sharp corner of the electrode and a deep aspect ratio provide degrade antifuse performance for the protection cell (resulting in reduced breakdown voltage and increased leakage current) and, as designed, the protection cell will rupture before other cells because it has a lower breakdown voltage. Once the protection cell ruptures, it will continue to conduct and protect other antifuses from ESD damage. When processing is complete, the protection cell is biased off and has no effect on the remaining antifuses. According to a second aspect of the present invention, a deep valley topography is created under a bottom electrode of the protection cell. Because the cell is deeper than the other antifuse cells while retaining the same cell opening size, the step coverage within the protection cell will be reduced and the protection cell will have a lower breakdown voltage than the regular antifuse cells formed with it. In all other respects, it operates as set forth regarding the first aspect of the invention.

REFERENCES:
patent: 4821096 (1989-04-01), Maloney
patent: 4829350 (1989-05-01), Miller
patent: 4862243 (1989-08-01), Welch et al.
patent: 4941028 (1990-07-01), Chen et al.
patent: 4997790 (1991-03-01), Woo et al.
patent: 5070384 (1991-12-01), McCollum et al.
patent: 5111262 (1992-05-01), Chen et al.
patent: 5166556 (1992-11-01), Hsu et al.
patent: 5171715 (1992-12-01), Husher et al.
patent: 5233217 (1993-08-01), Dixit et al.
patent: 5290734 (1994-05-01), Boardman et al.
patent: 5341267 (1994-08-01), Whitten et al.
patent: 5350710 (1994-09-01), Hong et al.
K. E. Gorden et al. "Conducting Filament of the Programmed Metal Electrode Amorphous Silicon Antifuse", IEDM 93 (Dec. 1993) pp. 27-30.

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