Method and apparatus for preventing plasma formation

Details Method and apparatus for preventing plasma formation Method and apparatus for preventing plasma formation

1997-09-23

2000-09-26

Lipman, Bernard

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

216 2, C23F 102

Patent

active

061238023

ABSTRACT:
A plasma etching device is described in which gas is introduced into a reaction chamber through holes in a gas distribution plate. An electrode ignites the source gas into a plasma by capacitive coupling, and sustains the plasma by inductive coupling. A localized shield structure is provided which suppresses the electric field in locations in or near the holes of the gas distribution plate. Thus, plasma ignition in or near these holes is prevented, and hole lightup effects are avoided. By virtue of eliminating hole lightup, improved flexibility in gas distribution plate design and alignment is provided.

REFERENCES:
patent: 5449410 (1995-09-01), Chang et al.
patent: 5641375 (1997-06-01), Nitescu et al.
patent: 5851343 (1998-12-01), Hsu et al.

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