Method of etching semiconductor material

Details Method of etching semiconductor material Method of etching semiconductor material

1984-09-04

1986-04-08

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

136250, 29572, 252 794, 252 793, 156633, 156634, 156644, 156645, 156651, 156657, 156662, 156667, 156904, H01L 21306, B44C 122, C23F 102

Patent

active

045811032

ABSTRACT:
The disclosure relates to a method of etching semiconductor material wherein the material is secured in an oxide coated aluminum foil which acts as an etchant mask. The portion of the material extending from one side of the foil can then be etched with a semiconductor material etchant with the remainder of the material being masked from the etchant by the foil.

REFERENCES:
patent: 4407320 (1983-10-01), Levine
patent: 4451968 (1984-06-01), Jensen et al.
patent: 4514580 (1985-04-01), Bartlett

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