Semiconductor device and method of manufacturing thereof

Details Semiconductor device and method of manufacturing thereof Semiconductor device and method of manufacturing thereof

1997-08-28

1999-02-16

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, 438617, H01L 2144

Patent

active

058720502

ABSTRACT:
A semiconductor device has a semiconductor element, an output terminal coupled to the semiconductor element and a thin metal member or foil secured to an output terminal. A protective layer covers the semiconductor element including the periphery of the metal foil to define an opening located at the metal foil. By covering the periphery of the metal foil, the protective layer secures the metal foil to the semiconductor element. A lead element is affixed to the metal foil by soldering through the opening. The resulting structure increases the adhesion of the lead element. Furthermore, because the protective film covers and seals the periphery of the metal foil, the advance of moisture into the inside of the semiconductor device is retarded. Accordingly the moisture resistance of the semiconductor device is improved.

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patent: 5107325 (1992-04-01), Nakayoshi
patent: 5133810 (1992-07-01), Morizane et al.
patent: 5438222 (1995-08-01), Yamazani

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