Methods and apparatus for passivating a substrate in a plasma re

Details Methods and apparatus for passivating a substrate in a plasma re Methods and apparatus for passivating a substrate in a plasma re

1997-06-25

1999-10-19

Breneman, Bruce

Coating apparatus

Gas or vapor deposition

With treating means

118504, 156345, 438731, C23C 1600

Patent

active

059682752

ABSTRACT:
A plasma processing system configured for use in processing a substrate after metal etching. The substrate includes a layer of photoresist disposed thereon. The plasma processing system includes a plasma generating region and a baffle plate disposed between the plasma generating region and the substrate. The baffle plate includes a central blocked portion disposed in a center region of the baffle plate. The baffle plate further includes an annular porous portion surrounding the central blocked portion. The annular porous portion includes a plurality of through holes configured for permitting a H.sub.2 O plasma generated in the plasma generating region to pass through the holes to reach a surface of the substrate. The plasma processing system also includes a chuck disposed below the baffle plate to support the substrate during the processing.

REFERENCES:
patent: 4534816 (1985-08-01), Chen et al.
patent: 4836902 (1989-06-01), Kalnitsky et al.
patent: 5114529 (1992-05-01), Masuyama et al.
patent: 5366557 (1994-11-01), Yu
patent: 5545289 (1996-08-01), Chen et al.
patent: 5741363 (1998-04-01), Van Buskirk et al.
Singh et al., Application of Plasma and Flow Modeling to the Design of Optimized Aluminum Equipment: Database Inspec Institute of Electrical Engineers, Stevenage, GB, 1997, Pennington, NJ, USA, Electrochem. Soc., USA, XP-002079763.
"Notification of Transmittal of the International Search Report," Oct. 26, 1998, European Patent Office.
"International Search Report," Oct. 26, 1998, European Patent Office.

Affiliated with

Also associated with

Rating

Methods and apparatus for passivating a substrate in a plasma re does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatus for passivating a substrate in a plasma re, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for passivating a substrate in a plasma re will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2050904