Process for manufacturing printed circuit employing selective pr

Details Process for manufacturing printed circuit employing selective pr Process for manufacturing printed circuit employing selective pr

1991-06-05

1992-11-03

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29852, 156645, 156656, 156902, 427 97, 430314, 205126, B44C 122, C23F 100

Patent

active

051605791

ABSTRACT:
The areas of a printed circuit where electrical components are to be solder connected, such as throughholes, surrounding pads and surface mount areas, are selectively provided with a metal coating (e.g., tin-lead) which preserves and promotes solderability thereat, by a process in which a photoimageable electrophoretically deposited organic resin is used to provide, on an already patterned surface, an additional resist pattern which selectively exposes areas on which the solderable metal coating is to be provided and in which the resist serves also as an etch resist for metal areas over which it is arranged.

REFERENCES:
patent: 3892646 (1975-07-01), Lazzarini et al.
patent: 4325780 (1982-04-01), Schulz
patent: 4487654 (1984-12-01), Coppin
patent: 4592816 (1986-06-01), Emmons et al.
patent: 4746399 (1988-05-01), Demmer et al.
patent: 4751172 (1988-06-01), Rodriguez et al.
patent: 4804615 (1989-02-01), Larson et al.
patent: 4861438 (1989-08-01), Banks et al.
patent: 4978423 (1990-10-01), Durnwith

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