Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1999-10-20
2000-07-18
Niebling, John F.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438637, 438638, 438666, 438668, 438687, H01L 2144
Patent
active
060906960
ABSTRACT:
A process used to create a non-smooth, top surface topography, for a semiconductor substrate, needed to improve the adhesion between a protective molding compound, and the underlying top surface of the semiconductor substrate, has been developed. The process features the creation of the non-smooth, top surface topography, including either: recessed, or etched back, copper damascene structures, in an insulator layer; or copper damascene structures, in a recessed, or etched back, insulator layer. The recessing of the copper damascene structures, or of the insulator layer, is accomplished via selective, dry or wet etch procedures. After formation of a gold wire bond, on the top surface of a copper damascene structure, a protective molding compound is applied, to the underlying, non-smooth, top surface topography.
REFERENCES:
patent: 5336456 (1994-08-01), Eskildsen et al.
patent: 5393700 (1995-02-01), Wong
patent: 5618381 (1997-04-01), Doan et al.
patent: 5659201 (1997-08-01), Wollesen
patent: 5714037 (1998-02-01), Puntambekar et al.
patent: 5785236 (1998-07-01), Cheung et al.
patent: 5804883 (1998-09-01), Kim et al.
patent: 5883435 (1999-03-01), Geffken et al.
patent: 5900668 (1999-05-01), Wollesen
patent: 5932907 (1999-08-01), Grill et al.
patent: 5952674 (1999-09-01), Edelstein et al.
patent: 5955781 (1999-09-01), Joshi et al.
patent: 6033939 (2000-03-01), Agarwala et al.
patent: 6033984 (2000-03-01), Schnabel et al.
Jang Syun-Ming
Liang Mong-Song
Ackerman Stephen B.
Gurley Lynne A.
Niebling John F.
Saile George O.
Taiwan Semicondutor Manufacturing Company
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