Method of patterning metal on a substrate using direct-write dep

Details Method of patterning metal on a substrate using direct-write dep Method of patterning metal on a substrate using direct-write dep

1991-07-26

1993-09-14

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156645, 156656, 1566591, 156668, 427123, 427125, H05K 300

Patent

active

052445380

ABSTRACT:
A method of patterning metal on a substrate without photolithography. The steps include providing a dielectric substrate, forming a metal mask in a predetermined pattern on the substrate without using a mask by direct-write deposition using a particle beam such as a liquid metal cluster force to form the mask, dry etching the substrate to form a plurality of channels therein, depositing a conductive metal into the channels, and removing the mask. The top of the substrate can then be planarized by polishing, or alternatively the dielectric between the metal lines can be etched. The invention is well suited for fabricating copper/polyimide substrates.

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