Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1981-02-27
1982-07-27
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156651, 156656, 204192E, C23F 100, B44C 122, C03C 1500, C03C 2506
Patent
active
043415946
ABSTRACT:
Contaminant metal residue on an organic passivation layer of a semiconductor device is removed by plasma etching thereof whereby the performance of the device is restored.
REFERENCES:
patent: 3806365 (1974-04-01), Jacob
patent: 4062720 (1977-12-01), Alcorn et al.
patent: 4180432 (1979-12-01), Clark
IBM Technical Disclosure Bulletin, vol. 21, No. 6, Nov. 1978, Plasma Removal of Residue Following Reactive Ion Etching of Aluminum and Aluminum Alloys by G. T. Chiu et al., p. 2315.
A. T. Bell, "An Introduction to Plasma Processing", Solid State Technology, Apr., 1978, pp. 89-94.
Carlson Richard O.
Yerman Alexander J.
Bruzga Charles E.
Davis Jr. James C.
General Electric Company
Powell William A.
Snyder Marvin
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