Electronic system circuit package directly supporting components

Details Electronic system circuit package directly supporting components Electronic system circuit package directly supporting components

1994-09-15

1996-04-02

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257668, 257723, H01L 2503, H01L 2707

Patent

active

055043704

ABSTRACT:
An electronic system circuit package is disclosed herein. The package utilizes a lead frame having an electrically conductive component support segment incorporating provisions for mounting a plurality of electronic components directly on the support segment in accordance with a predetermined circuit design. The circuit package is then encapsulated in a dielectric medium. In a preferred embodiment, at least some of the electronic components are mounted directly to electrically isolated subsegments of the component support segment and electrically interconnected through their respective subsegments to other components.

REFERENCES:
patent: 4297647 (1981-10-01), Akiyama et al.
patent: 4859633 (1989-10-01), Bayraktaroglu
patent: 5115298 (1992-05-01), Loh
patent: 5198824 (1993-03-01), Poradish
patent: 5321299 (1994-06-01), Ohkawa et al.

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