Electronic assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165 802, 165 803, 174 163, 257719, 257727, 361710, 361719, 361769, 361809, 361820, H05H 720

Patent

active

061281905

ABSTRACT:
An aluminum heat sink bridge (1), mounted overlying a transistor unit (5) on a circuit board (12), has affixed to its underside, along two lateral edges, a pair of resilient plastic or rubber members (4), which, when the bridge is screwed down into place, exert continuous vertical pressure on the collector tab (8) and the base tab (7) keeping them in electrical contact with their underlying electrical contact points on the circuit board (12) while permitting horizontal movement of the tabs due to variations in temperature. One embodiment of the invention has resilient members extending the entire length of the bridge to exert vertical pressure on grounding tabs (9) extending laterally from the ends of the transistor unit.

REFERENCES:
patent: 5065280 (1991-11-01), Karnezos et al.
patent: 5176524 (1993-01-01), Mizuno et al.
patent: 5392193 (1995-02-01), Robertson, Jr. et al.
patent: 5426405 (1995-06-01), Miller et al.
patent: 5530291 (1996-06-01), Chan et al.
patent: 5825089 (1998-10-01), Valenti et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electronic assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-201719

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.