Method of fabricating an integrated circuit interconnection

Details Method of fabricating an integrated circuit interconnection Method of fabricating an integrated circuit interconnection

1991-11-08

1993-12-07

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437190, 437197, 437200, H01L 2144

Patent

active

052683290

ABSTRACT:
A conductive layer is formed beneath a runner in an integrated circuit. The conductive layer is also formed within vias. The conductive layer preserves electrical connection should the runner separate due, perhaps, to electromigration or stress voiding. The conductive layer also provides protection against various failures or defects which may occur in the runner material within the vias.

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