Liquid jet recording head and recording apparatus using same

Details Liquid jet recording head and recording apparatus using same Liquid jet recording head and recording apparatus using same

1995-03-20

1996-11-05

Berman, Susan W.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

522 95, 522 97, 522109, 522112, B41J 216, C08F 250, C08L 5700, G03F 7004

Patent

active

055716598

ABSTRACT:
A process is disclosed for producing a liquid jet recording head comprising applying an active energy-curing resin composition onto at least a part of a surface of a first member for forming a wall of the liquid path; exposing the applied active energy-ray-curing resin to an active energy ray selected from the group consisting of an ultraviolet-ray having an intensity of 1 mW/cm.sup.2 to 100 mW/cm.sup.2 and an electron beam having an intensity of 0.5M Rad to 20M Rad; and providing a second member on the exposed active energy-ray-curing resin composition.

REFERENCES:
patent: 4417251 (1983-11-01), Sugitani
patent: 4509063 (1985-04-01), Sugitani et al.
patent: 4657631 (1987-04-01), Noguchi
patent: 4688052 (1987-08-01), Inamoto et al.
patent: 4688053 (1987-08-01), Noguchi et al.
patent: 4688054 (1987-08-01), Inamoto et al.
patent: 4688055 (1987-08-01), Noguchi et al.
patent: 4688056 (1987-08-01), Noguchi et al.
patent: 4775445 (1988-10-01), Noguchi
patent: 5068262 (1991-11-01), Noguchi
patent: 5086307 (1992-02-01), Noguchi et al.

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