Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1998-06-15
2000-08-15
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257685, 257686, H01L 2304
Patent
active
061040886
ABSTRACT:
A complementary wiring package including a package, a first set of external pins mounted in a central region on a top surface of the package in a vertical direction and connected to a plurality of respectively corresponding through holes, a second set of external pins being mounted in a perimeter region on a top surface of the package in a vertical direction and connected to printed wiring of a printed wiring board, and a plurality of internal lines that connect the first set of external pins to the second set of external pins. The complementary wiring package does not require a semi-conductor integrated circuit and is capable of being coupled with an semi-conductor integrated circuit package via the plurality of respectively corresponding through holes of the printed wiring board which is sandwiched between the complementary wiring package and the semi-conductor integrated circuit package.
REFERENCES:
patent: 3648131 (1972-03-01), Stuby
patent: 4074342 (1978-02-01), Honn et al.
patent: 5521435 (1996-05-01), Mizukoshi
patent: 5640051 (1997-06-01), Tomura et al.
patent: 5847936 (1998-12-01), Forehand
Hatano Hiromitsu
Yashiro Akira
Clark Sheila V.
Ricoh & Company, Ltd.
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