Package for integrated devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257692, 257696, H01L 2348, H05K 108

Patent

active

053671929

ABSTRACT:
This package for integrated devices, to be fixed on supporting plates, in particular on printed circuits, comprises contact pins to be inserted in holes of the supporting plates and to be soldered thereto. To prevent overturning of the package, which may lead to short circuits among the components, at least some of the contact pins are provided with protruding portions defining abutments cooperating with the supporting plate to limit the inclination of the package with respect to the plate.

REFERENCES:
patent: 4171855 (1979-10-01), Raskin
patent: 4215361 (1980-07-01), McCarthy
patent: 4247981 (1981-02-01), Walters
patent: 4642670 (1987-02-01), Striny

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Package for integrated devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package for integrated devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package for integrated devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1992953

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.