Microbump interconnect for semiconductor dice

Details Microbump interconnect for semiconductor dice Microbump interconnect for semiconductor dice

1998-07-31

2000-10-03

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

781 48, H01L 2348, H01L 2352, H01L 2940

Patent

active

061277363

ABSTRACT:
A method for forming an interconnect for making a temporary or permanent electrical connection to a semiconductor dice is provided. The interconnect includes a rigid substrate on which an insulating layer and a pattern of conductors are formed. A compliant layer is formed on the insulating layer of a material such as polyimide. Vias are formed in the compliant layer with metal contacts in electrical communication with the conductors. Microbumps are formed on the compliant layer in electrical communication with the contacts and are adapted to flex with the compliant layer. The interconnect can be used to provide a temporary electrical connection for testing bare semiconductor dice. Alternately the interconnect can be used for flip chip mounting dice for fabricating multi chip modules and other electronic devices.

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