Semiconductor package and manufacture thereof

Details Semiconductor package and manufacture thereof Semiconductor package and manufacture thereof

1991-05-29

1992-10-20

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 524, 361386, 361412, H05K 720

Patent

active

051575884

ABSTRACT:
The present invention relates to a semiconductor package which is loaded with a plurality of high-performance integrated circuits for high-performance systems such as super computers and large-sized computers. According to the invention, the packaging density of the semiconductor is doubled by stacking upper and lower members and forming substrates loaded with a plurality of chips in a multistep structure so that the size of computers can be minimized and heat emission efficiency can be improved by forming heat sinks in a fin-pin shape.

REFERENCES:
patent: 4296456 (1981-10-01), Reid
patent: 4320438 (1982-03-01), Ibrahim
patent: 4468717 (1984-08-01), Mathias
patent: 4716498 (1987-12-01), Ellis
patent: 4926242 (1990-05-01), Itoh
patent: 4980753 (1990-12-01), Dunaway
patent: 5041899 (1991-08-01), Oku
patent: 5053853 (1991-10-01), Haj-Ali-Ahmadi

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