Dram cell with a multiple mushroom-shaped capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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Details

257534, H01L 2968, H01L 27108, H01L 2700

Patent

active

061371319

ABSTRACT:
The capacitor includes a first storage node formed over a semiconductor wafer. The first storage node has a plurality of mushroom-shape structures. The plurality of mushroom-shape structures are randomly arranged on the first storage node to increase the area of the first storage node. A dielectric layer conformally covers the first storage node. A second storage node is formed on the dielectric layer.

REFERENCES:
patent: 5138411 (1992-08-01), Sandha
patent: 5459345 (1995-10-01), Okudaira et al.
patent: 5561310 (1996-10-01), Woo et al.
patent: 5623243 (1997-04-01), Watanabe et al.
M. Sakao et al., A Capacitor-Over-Bit-Line (COB) Cell with a Hemispherical-Grain Storage Node for 64Mb DRAMs, 1990 IEEE, pp. 655-658.
Sanggi Yu et al., The Honeycomb-Shape Capacitor Structure for ULSI DRAM, 1993 IEEE, pp. 369-371.
Shye Lin Wu et al., Tunnel Oxide Prepared by Therman Oxidation of Thin Polysilicon Film on Silicon (TOPS), 1993 IEEE, pp. 379-381.
S.H. Woo et al., Selective Etching Technology of in-situ P Doped Poly-Si (SEDOP) for High Density DRAM Capacitors, 1994 IEEE, pp. 25 and 26.

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