Migration from control wafer to product wafer particle checks

Semiconductor device manufacturing: process – Including control responsive to sensed condition – Electrical characteristic sensed

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H01L 2100

Patent

active

061366153

ABSTRACT:
A method is provided for performing in-line process checks in an integrated circuit fabrication process. The process checks are performed on actual product wafers, rather than control wafers. According to the method, production lots of product wafers are subjected to in-line testing. Selected wafers representing each chamber of the fabrication apparatus are tested for defects. Using the actual product wafers allows the detection of the quantity, size, type, composition, and even the cause of the defects. When defects are found, the fabrication process and apparatus are adjusted to avoid producing additional lots with undesirable defects.

REFERENCES:
patent: 5773315 (1998-06-01), Jarvis
patent: 5844249 (1998-12-01), Takano et al.
patent: 5886909 (1999-03-01), Milor et al.

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